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Baraf-S 3.5g

THERMAL PASTE

Baraf is a high-performance thermal paste that enhances the efficiency of heat conduction. Easy to apply and perfectly fills the space between your cooler and CPU. Nanotechnology in the paste improves heat conduction via its micro molecules. Made with non-electric conductive materials, the Baraf is completely safe to use. Comes with a spreader for quick and easy application.

• High viscocity allows for easy application
• Nanotechnology improves heat conduction
• Non-electric conductive materials ensure safe usage
• Low evaporation point and high temperature tolerance
• Spreader allows for quick and easy application
• Comes with 3.5g thermal paste

Specifications are subject to change without notice.
Products and models may vary depending on your region.
Contact your local retailer for more information.

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FEATURES

HIGHLY EFFICIENT

BARAF-S 3.5g is a high performance thermal paste. It enhances the efficiency of the heat conduction, so you can game for hours and not even sweat about overheating your CPU!

EASY TO APPLY

Thanks to its viscosity, BARAF-S 3.5g thermal paste is easy to apply and allows perfect filling between your cooler and CPU. Low evaporation point and high temperature tolerance allow this paste to last a lifetime.

COMPLETELY SAFE

Made with non-electric conductive material. The thermal paste is completely safe and the nanotechnology in the paste improves heat conduction via its micro molecules.

PRODUCT GALLERY

SPECS

Model Baraf-S 3.5g
Thermal Conductivity >5.15 W/m-K
Thermal Impedance < 0.004 ℃-in2/W
Specific Gravity >3.25
Viscosity 12500
Moment Beared Temperature -50~340℃
Thixotropic Index 280/0.1mm
Operation Temperature -30℃ – 280℃
Silicone Compounds 10%

Carbon Compounds 45%
Metal Oxide Compounds 45%
Net Weight 3.5g

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