Verkho 3

CPU AIR COOLER

PWM air cooling solution powered by Heat Core Touch Technology (HCTT) with 3 ultra-efficient thermal heat pipes. Comes equipped with high efficiency fins for more effective heat dissipation. Capable of mounting single 90mm fan configurations and works with most current motherboard designs.

Heat Core Touch Technology with 3 ultra-efficient thermal heat pipes
Upgraded high efficiency fins for maximum thermal performance
TDP (Thermal Design Power) up to 120W
Capable of mounting single 90mm fan configurations
Compact profile for maximum compatibility
Compatible with most current motherboard designs

Specifications are subject to change without notice.
Products and models may vary depending on your region.
Contact your local retailer for more information.

FEATURES

HEAT CORE TOUCH TECHNOLOGY (HCTT)

Three heatpipes provide a perfectly flat surface which ensure faster heat dissipation.

90MM PWM HIGH-PRESSURE FAN

High-pressure fan provides a stronger airflow to push the heat away from the aluminum fin faster.

90MM PWM HIGH-PRESSURE FAN

High-pressure fan provides a stronger airflow to push the heat away from the aluminum fin faster.

EFFICIENT ALUMINUM FINS

The uneven fin surface design creates heat dissipating area.
It is compatible with most CPUs due to a compact design.

DIMENSIONS

PRODUCT GALLERY

SPECS

Model Verkho 3
Base Material HCTT (Heat Core Touch Technology)
Fin Material Aluminum
Heat pipe 6mm x 3
Dimensions (L x W x H) 120 x 81 x 122.5 mm
TDP (Thermal Design Power) 120
Fan Speed 1000-2500 RPM
Fan Connector PWM 4-Pin
Fan Dimension 90 x 90 x 25 mm
Bearing System Hydraulic
Rated Voltage 12V
Starting voltage 5V

Rated current 0.2A
Power Consumption 2.4W
Fan Air Pressure 0.55-1.15 mm/H2O
Fan Air Flow 18.9-45.5 CFM
Fan Noise 15-24 dBA
MTBF 60000 hrs.
Socket LGA 1700 / 1200 / 115X / 775
AM5 / AM4 / AM3+ / AM3 / AM2+ / AM2 / FM2 / FM1
For compatibility, check that LGA1700/AM5 is listed as a supported bracket on the packaging.

DOWNLOAD

Download your user manual here.